Fundamentals of Lead-Free Solder Interconnect Technology

€ 87,99
Bisher € 88,09
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November 2014



This unique book provides an up-to-date overview of the concepts behind lead-free soldering techniques. Readers will find a description of the physical and mechanical properties of lead-free solders, in addition to lead-free electronics and solder alloys. Additional topics covered include the reliability of lead-free soldering, tin whiskering and electromigration, in addition to emerging technologies and research.


Interconnection : The Joint.
Phase Equilibria and Microstructure of Sn-Ag-Cu Alloys.
Microstructure Development; Solidification and Isothermal Aging.
Thermal Cycling Performance.
Mechanical Stability and Performance.
Chemical and Environment Attack.
Challenges in Future Generation Interconnects: Microstructure Again.



From the book reviews:

'The book gives wide perspectives on the technical insights of lead-free solder interconnect system and reliability prediction in industry while adding very valuable industry insights. It is a good resource to demonstrate the many facets of lead-free solder interconnection, and can serve as a very informative technical reference. Valuable as a learning tool for fundamentals of lead-free solder interconnect technology, its clear relevance to real world industry practices make it useful for both academics and semiconductor industry practitioners.' (Chong Leong Gan and Uda Hashim, Microelectronics Reliability, February, 2015)

EAN: 9781461492665
Untertitel: From Microstructures to Reliability. 2015. Auflage. 70 schwarz-weiße und 81 farbige Abbildungen, 18 schwarz-weiße Tabellen, Bibliographie. eBook. Sprache: Englisch. Dateigröße in MByte: 15.
Verlag: Springer US
Erscheinungsdatum: November 2014
Seitenanzahl: xiii253
Format: pdf eBook
Kopierschutz: Adobe DRM
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